Stanford, California, USA: For the first time, a three-dimensional semiconductor chip has demonstrated measurable performance improvements and has been successfully produced at a commercial manufacturing facility.

Professors of Indian origin, Subhasish Mitra and Tathagata Srimani, together with a group of engineers from Stanford University, Carnegie Mellon University, the University of Pennsylvania, and the Massachusetts Institute of Technology, have developed the world’s first monolithic 3D chip designed to enhance artificial intelligence processing.

The research team partnered with SkyWater Technology, the largest semiconductor foundry operating solely within the United States, to create an advanced multilayer chip. This innovative architecture is expected to play a key role in shaping the next generation of AI hardware while supporting growth in domestic semiconductor manufacturing.